Mod-01 Lec-01 Introduction and Objectives of the course Electronics 52 min Click to view videos

Video Lecture Description Sub-Category Time Click to view video Back to Engineering Video Lecture Course Page Mod-01 Lec-01 Introduction and Objectives of the course Electronics 52 min Click to view videos Mod-01 Lec-02 Definition of a system and history of semiconductors Electronics 53 min Click to view videos Mod-01 Lec-03 Products and levels of packaging Electronics 60 min Click to view videos Mod-01 Lec-04 Packaging aspects of handheld products; Case studies in applications Electronics 57 min Click to view videos Mod-01 Lec-05 Case Study (continued); Definition of PWB, summary and Questions for review Electronics 56 min Click to view videos Mod-02 Lec-06 Basics of Semiconductor and Process flowchart; Video on “Sand-to-Silicon” Electronics 58 min Click to view videos Mod-02 Lec-07 Wafer fabrication, inspection and testing Electronics 57 min Click to view videos Mod-02 Lec-08 Wafer packaging; Packaging evolution; Chip connection choices Electronics 61 min Click to view videos Mod-02 Lec-09 Wire bonding, TAB and flipchip-1 Electronics 57 min Click to view videos Mod-02 Lec-10 Wire bonding, TAB and flipchip-2; Tutorials Electronics 63 min Click to view videos Mod-03 Lec-11 Why packaging? & Single chip packages or modules (SCM) Electronics 60 min Click to view videos Mod-03 Lec-12 Commonly used packages and advanced packages; Materials in packages Electronics 59 min Click to view videos Mod-03 Lec-13 Advances packages (cont),Thermal mismatch in packages,Current trends in pack Electronics 59 min Click to view videos Mod-03 Lec-14 Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps Electronics 59 min Click to view videos Mod-04 Lec-15 Electrical Issues — I; Resistive Parasitic Electronics 56 min Click to view videos Mod-04 Lec-16 Electrical Issues — II; Capacitive and Inductive Parasitic Electronics 59 min Click to view videos Mod-04 Lec-17 Electrical Issues — III; Layout guidelines and the Reflection problem Electronics 58 min Click to view videos Mod-04 Lec-18 Electrical Issues — IV; Interconnection Electronics 47 min Click to view videos Mod-05 Lec-19 Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DF Electronics 57 min Click to view videos Mod-05 Lec-20 Components of a CAD package and its highlights Electronics 59 min Click to view videos Mod-05 Lec-21 Design Flow considerations; Beginning a circuit design with schematic work Electronics 57 min Click to view videos Mod-05 Lec-22 Demo and examples of layout and routing; Technology file generation from CAD Electronics 62 min Click to view videos Mod-06 Lec-23 Review of CAD output files for PCB fabrication; Photo plotting and mask gene Electronics 56 min Click to view videos Mod-06 Lec-24 Process flow-chart; Vias; PWB substrates Electronics 61 min Click to view videos Mod-06 Lec-25 Substrates continued; Video highlights; Surface preparation Electronics 58 min Click to view videos Mod-06 Lec-26 Photoresist and application methods,UV exposure and developing Electronics 61 min Click to view videos Mod-06 Lec-27 PWB etching; Resist stripping; Screen-printing technology Electronics 59 min Click to view videos Mod-06 Lec-28 Through-hole manufacture process steps; Panel and pattern plating methods Electronics 59 min Click to view videos Mod-06 Lec-29 Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs Electronics 60 min Click to view videos Mod-06 Lec-30 Microvia technology and Sequential build-up technology process flow for high Electronics 60 min Click to view videos Mod-06 Lec-31 Conventional Vs HDI technologies; Flexible circuits; Tutorial session Electronics 64 min Click to view videos Mod-07 Lec-32 SMD benefits; Design issues; Introduction to soldering Electronics 59 min Click to view videos Mod-07 Lec-33 Reflow and Wave Soldering methods to attach SMDs Electronics 59 min Click to view videos Mod-07 Lec-34 Solders; Wetting of solders; Flux and its properties; Defects in wave solder Electronics 59 min Click to view videos Mod-07 Lec-35 Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures Electronics 57 min Click to view videos Mod-07 Lec-36 SMT failure library and Tin Whiskers Electronics 59 min Click to view videos Mod-07 Lec-37 Tin-lead and lead-free solders,Phase diagrams,Thermal profiles for reflow so Electronics 59 min Click to view videos Mod-07 Lec-38 Lead-free solder considerations,green electronics,RoHS compli & e-waste recy Electronics 61 min Click to view videos Mod-08 Lec-39 Thermal Design considerations in systems packaging Electronics 64 min Click to view videos Mod-09 Lec-40 Introduction to embedded passives; Need for embedded passives; Design Librar Electronics 59 min Click to view videos Mod-09 Lec-41 Embedded capacitors; Processes for embedding capacitors; Case study examples Electronics 60 min Click to view videos Mod-10 Lec-42 Chapter-wise summary Electronics 58 min Click to view videos